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318548 -001 Intel ® Celeron ® Processor 200 Δ Sequence Thermal and Mechanical Design Guidelines — Supporting the Intel ® Celeron ® processor 220 Δ October 2007 ...
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2 Thermal and Mechanical Design Guidelines INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS . NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIAB ...
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Thermal and Mechanical Design Guidelines 3 Contents 1 Introduc tion ..................................................................................................... 7 1.1 Document Goal s and Sc ope ..................................................................... 7 1.1.1 Importance of Th ermal Manage ment .................................. ...
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4 Thermal and Mechanical Design Guidelines Appendix A Heatsink Clip Lo ad Metr ology ............................................................................ 43 A.1 Overview ............................................................................................ 43 A.2 Test Pre paration ...................................................... ...
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Thermal and Mechanical Design Guidelines 5 Tables Table 1. Micro-FCBGA Packag e M echanical Specifications ..................................... 12 Table 2. Thermal Specifi cations for Intel ® Celeron ® Processor 200 Sequ ence .......... 19 Table 3. System T hermal Solution Design Req uirement ....................................... 22 Table 4. T ...
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6 Thermal and Mechanical Design Guidelines Revision History Revision Number Description Revision Date -001 • Initial Re lease October 2007 § ...
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Introduction Thermal and Mechanical Design Guidelines 7 1 Introduction 1.1 Document Goals and Scope 1.1.1 Importance of Thermal Management The objective of thermal management is to ensure that the temperatures of all components in a system are maintained withi n their functional temperature range. Within this temperature range, a component i s expe ...
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Introduction 8 Thermal and Mechanical Design Guidelines 1.1.3 Document Scope This design guide supports the foll owing processors: • Intel ® Celeron ® Processor 200 sequence applies to the Intel ® Celeron ® processor 220. In this document the Intel Celeron Processo r 200 sequence w ill be refe rred to as “the processor”. In this document ...
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Introduction Thermal and Mechanical Design Guidelines 9 1.2 Reference Documents Material and concepts availabl e in the following documents may be benefi cial when reading this docu ment. Document Document No./Location Intel ® Celeron ® Processor 200 Sequence Datasheet http://developer.intel .com/design/processo r/datashts/318546.ht m Power Suppl ...
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Introduction 10 Thermal and Mechanical Design Guidelines Term Description (T S – T A ) / Total Package Power. Note: Heat source must be specified for Ψ measurements. TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor die surface. This material fills the air gaps and v oids, and enhances the t ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 11 2 Processor Thermal/Mechanical Information 2.1 Mechanical Requirements 2.1.1 Processor Package The Intel Celeron processor 200 sequence is avail able in a 479-pi n Micro-FCBGA package, as shown in Figure 1 to Figure 3. The proc essor us es a Flip- Chip Ball Grid Ar ...
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Processor Thermal/Mechanical Information 12 Thermal and Mechanical Design Guidelines Table 1. Micro-FCBGA Package Mechanical Specifications Symbol Parameter Min Max Unit Figure B1 Package substrate wi dth 34.95 35.05 mm Figure 2 B2 Package substrate length 34.95 35.05 mm Figure 2 C1 Die width 11.1 mm Figure 2 C2 Die length 8.2 mm Figure 2 F2 Die he ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 13 Figure 1. Micro-FCBGA Processor Package Drawing – Isometric View ...
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Processor Thermal/Mechanical Information 14 Thermal and Mechanical Design Guidelines Figure 2. Micro-FCBGA Processor Package Drawing (Sheet 1 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details. ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 15 Figure 3. Micro-FCBGA Processor Package Drawing (Sheet 2 of 2) NOTE: All dimensions in millimeters. Values shown are for reference only. See Table 1 for specific details. ...
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Processor Thermal/Mechanical Information 16 Thermal and Mechanical Design Guidelines 2.1.2 Heatsink Attach 2.1.2.1 General Guidelines The micro-FCBGA package may have capacitors placed i n the area surrounding the processor die. The die-side capaci tors, which are only sli ghtly shorter than the die height, are electrically conductive and contact w ...
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Intel 200 - page 17
Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 17 depen ding on clip stiffness, the initial pr eload at b eginning o f life of the p roduct may be significantly hi gher than the minimum preload that must be met throughout the li fe of the product. Refer to Append ix A for clip load metrolog y guideline s. 2.1.2.3 ...
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Processor Thermal/Mechanical Information 18 Thermal and Mechanical Design Guidelines Figure 4. Vertical Lock-Down Alignment Feature Figure 5. Various Types of Solder Crack 2.2 Thermal Requirements The pro cessor r equires a thermal so lution to maint ain temper atures with in operat ing limits. Refer to the datasheet for the proce ssor ther mal spe ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 19 2.2.1 Processor Junction Temperature Table 2. Thermal Specifications for Intel ® Celeron ® Processor 200 Sequence Symbol Processor Number Core Frequency and Voltage Cache Thermal Design Power (W) Notes TDP 220 1.20 GHz 512 KB 19 1, 4, 5 Symbol Parameter Min Max N ...
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Processor Thermal/Mechanical Information 20 Thermal and Mechanical Design Guidelines air, T A , and the local air veloci ty over the surface. The higher the air veloci ty over the surface, and the cooler the air, the more effici ent is the resulting cool ing. The nature of the airflow can also enhance heat transfer via convecti on. Turbulent flow c ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 21 2.3.2 Heatsink Mass With the need to push air cooling to better performance, heatsi nk solutions tend to grow larg er (incr ease in fin surface) resultin g in increa sed mas s. The ins ertion of highly thermally conductive materials li ke copper to increase heatsin ...
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Processor Thermal/Mechanical Information 22 Thermal and Mechanical Design Guidelines 2.4 System Thermal Solution Considerations 2.4.1 Chassis Thermal Design Capabilities The reference thermal solution for the Intel Cel eron processor 200 sequence on the Intel Desktop Board D201GLY2 is a passive heatsi nk design, which requires chassi s to deliver s ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 23 By analyzing airflo w condition in an μ ATX chassis, a case study in Figure 6 shows that a chassis layout is criti cal to components cooling in the system. The al ignment of system fan (80×80mm 2 ) with power supply fan results in pass-through airfl ow which bypa ...
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Processor Thermal/Mechanical Information 24 Thermal and Mechanical Design Guidelines Figure 7. Case Study #2: Relocate System Fan to CAG Venting for A irflow Improvement Figure 8. Case Study#3: An μ ATX Chassis Equipped with Two Exhaust Fans ...
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Processor Thermal/Mechanical Information Thermal and Mechanical Design Guidelines 25 Figure 9. Case Study #4: A “Top Mount Fa n” PSU is located next to Processor in μ ATX Chassis for System Therma l Performance Improvement 2.4.3 Summary In summary, heatsink design considerations for the Intel Celeron processor 200 sequence on the Intel Desktop ...
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Processor Thermal/Mechanical Information 26 Thermal and Mechanical Design Guidelines ...
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Thermal Metrology Thermal and Mechanical Design Guidelines 27 3 Thermal Metrology This se ction disc usses g uidelines for test ing ther mal solutions , including measuring processor temperatures. In all cases, the thermal engi neer must measure power dissipation and temperature to vali date a thermal solution. To define the performance of a therma ...
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Thermal Metrology 28 Thermal and Mechanical Design Guidelines For reference thermal solution of Intel Cel eron processor 200 sequence on Intel Desktop Board D201GLY2, the junction-to-local ambient thermal characterization parameter of the processor, Ψ JA , is comprised of Ψ JS , the thermal interface material thermal characterization parameter, ? ...
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Thermal Metrology Thermal and Mechanical Design Guidelines 29 Figure 10 illustrate s the combin ation of the different th ermal chara cterization parameters. Figure 10. Processor Thermal Charac terization Parameter Relationships 3.1.1 Example The cooling performance, Ψ JA, is then defi ned using the principle of thermal characterization parameter ...
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Thermal Metrology 30 Thermal and Mechanical Design Guidelines To determine the required heatsink performance, a heatsink sol ution provider would need to determine Ψ JS performance for the selected TIM and mechanical load configuration. If the heatsink soluti on were designed to work with a TIM material performing at Ψ JS ≤ 0.50 °C/W, solving ...
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Thermal Metrology Thermal and Mechanical Design Guidelines 31 measureme nts will reveal a high ly non-uniform temp erature dist ribution across the inlet fan s ection. For passive heatsinks , thermocouples should be placed approximatel y 3 mm away from the heatsink as shown in Figure 12. Note: Testing an active heatsink with a variabl e speed fan c ...
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Thermal Metrology 32 Thermal and Mechanical Design Guidelines Figure 12. Locations for Measuring Loca l Ambient Temperature, Passive Heatsink 3M M AW AY FR O M H E AT S I N K SI D E S TOP VIEW POTISTION THERMOCOUPLES (X4) AT L O C AT I O N S AS I N D I C AT E D TO MEASURE T A . TC1 TC2 TC3 TC4 HALF OF HEATSINK FIN HEIGHT SIDE VIEW 3M M AW AY FR O M ...
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Thermal Metrology Thermal and Mechanical Design Guidelines 33 3.3.1 Sample Preparation In order to accurately measure the processor power consumption, it is requi red to attach sense resistor and replace one of the motherboard resistors. Schematic diagram in Figure 13 illustrat es the p recisio n resist or (R SENSE ) attached in series with process ...
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Intel 200 - page 34
Thermal Metrology 34 Thermal and Mechanical Design Guidelines Figure 13. Precision Resistor Connected in -series with Processor Circuitry for Power Measurement Figure 14. Installation of Isotek Resistor on Intel ® Desktop Board D201GLY2 to Setup Connection for Power Measurement Isote k Resistor Measuring V i Measuring V CC 1 2 1 2 Isote k Resistor ...
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Thermal Metrology Thermal and Mechanical Design Guidelines 35 Figure 15. Probing Resistance of the Soldered Walsin Resistor (R =19.6 K Ω ) on Intel ® Desktop Board D201GLY2 to Ensure Proper Attachment Figure 16. Precision Resistor Soldered on on Intel ® Desktop Board D201GLY2, and Connected to netDAQ for Voltage Measurement § ...
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Thermal Metrology 36 Thermal and Mechanical Design Guidelines ...
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System Thermal/ Mechanical Design Informat ion Thermal and Mechanical Design Guidelines 37 4 System Thermal/Mechanical Design Information 4.1 Overview of the Reference Design This chap ter will docu ment the re quiremen ts for des igning a pas sive heatsin k that meets the maximum usage power consumption that mentioned in Secti on 2.4. The Intel ® ...
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System Thermal/Mechanic al Design Information 38 Thermal and Mechanical Design Guidelines 4.2 Environmental Reliability Testing 4.2.1 Structural Reliability Testing Structur al reliability t ests con sist of unp ackaged , board- level vibrat ion and sho ck tests of a given th ermal solution in the asse mbled sta te. The th ermal solution should mee ...
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System Thermal/ Mechanical Design Informat ion Thermal and Mechanical Design Guidelines 39 Figure 18. Shock Acceleration Curve 0 10 20 30 40 50 60 0 2 4 6 8 10 12 Ti me ( m illi s e c o n d s ) A c c e l e r a t i o n (g ) 4.2.1.2.1 Recommended Test Sequence Each test sequence should start with components (i.e. motherboard, heatsink assembly, e tc. ...
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System Thermal/Mechanic al Design Information 40 Thermal and Mechanical Design Guidelines 4.2.2 Power Cycling Thermal performance degradation due to TIM degradation i s evaluated using power cycling testing. The test i s defined by 7500 cycles for the heatsink temperature from room temperature (~23 ºC) to T S-TOP-MAX at usage power consumption. 4. ...
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System Thermal/ Mechanical Design Informat ion Thermal and Mechanical Design Guidelines 41 4.4 Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: • UL Recog nition-app roved for flammability at th e system le vel. All mechanic al and thermal enabling components ...
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System Thermal/Mechanic al Design Information 42 Thermal and Mechanical Design Guidelines ...
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Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 43 Appendix A Heatsink Clip Load Metrology A.1 Overview The primary objective of the preload measur ement is to ensure the prel oad designed into the re tention me chanism is able to meet minimum o f 8.7lbf at e nd-of-line a nd does not violate the maximum specifi cations of the ...
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Heatsink Clip Load Metrology 44 Thermal and Mechanical Design Guidelines Table 5. Typical Test Equipment 7. Item 18. Description 9 . Part Number (Model) 20. Load cell 21. Notes: 1, 5 22. Honeywell*-Sensotec* Model 13 subminiature load cells, compression only 23. Select a load range depending on load level being tested. 24. www.sensotec.com 25. AL32 ...
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Heatsink Clip Load Metrology Thermal and Mechanical Design Guidelines 45 A.3 Test Procedure Examples The following proced ure is for a generic z- clip solut ion using the clip force time0 measurement machine at room temperature: 1. Install anchors onto top plate. Anchor can be secured usi ng epoxy or glue. 2. Fasten top plate onto the clip force me ...
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Heatsink Clip Load Metrology 46 Thermal and Mechanical Design Guidelines Figure 20. Anchors Installed and Glued Down the BTX Base Plate – for reference only § ...
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Intel® Enabled Boxed Processor Thermal Solut ion Information Thermal and Mechanical Design Guidelines 47 Appendix B Intel ® Enabled Boxed Processor Thermal Solution Information This ap pendix inc ludes sup plier inform ation for I ntel enab led vend ors. Table 6 lists sup pliers th at prod uce Inte l ® Boxed Processor thermal solution E21953- 00 ...
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Intel® Enabled Boxed Processor Thermal Solut ion Information 48 Thermal and Mechanical Design Guidelines ...
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Mechanical Drawings Thermal and Mechanical Design Guidelines 49 Appendix C Mechanical Drawings The following table list s the mec hanical dra wings includ ed in this append ix. These drawings refer to the reference thermal mechanical enabl ing components for the processor. Note: Intel reserves the right to make changes and modifications to the desi ...
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Mechanical Drawings 50 Thermal and Mechanical Design Guidelines Figure 21. Motherboard Keep-out Footprin t Definition and Height Restrictions for Enabling Components ...
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Mechanical Drawings Thermal and Mechanical Design Guidelines 51 Figure 22. Reference Clip E21952-001 ...
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Mechanical Drawings 52 Thermal and Mechanical Design Guidelines Figure 23. Reference Heatsink D96271-001 ...
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Mechanical Drawings Thermal and Mechanical Design Guidelines 53 Figure 24. Intel ® Boxed Processor Thermal Solution E21953-001 § ...
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