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Manual Samsung DDR3

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  • Samsung DDR3 - page 1

    October 2009 General Information DDR3 SDRAM DDR3 SDRAM Product Guide October 2009 Memory Division ...

  • Samsung DDR3 - page 2

    October 2009 General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 04 : x 4 08 : x 8 16 : x16 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 3. DRAM T ype 4. Density 5. Bit Organi zation 6. # of Internal Banks M A B C D E F G H Z H J M C L Y 9. Package T ype 8. Revision 10. T emp & Power 1. SAMS ...

  • Samsung DDR3 - page 3

    October 2009 General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide * Note : 1.35V product is 1.5V operatable. Density Banks Part Number Package & Power , Te m p . (-C/-L) & Speed Org. VDD V oltage PKG Ava i l. Note 1Gb D-die 8Banks K4B1G0446D HC(L)F7/F8/H9 256M x 4 1.5V 78 + 4 ball FBGA Now K4B1G0846D HC(L)F7/F8/H9 128M x 8 K ...

  • Samsung DDR3 - page 4

    October 2009 General Information DDR3 SDRAM 3 : DIMM 4 : SODIMM Z FBGA(Lead-f ree) H FBGA(Lead-free & Halogen-free) J FBGA(Lead-f ree, DDP) M FBGA(Lead-free & Halogen-free, DDP) 32 : 32M 33 : 32M (for 128Mb/512Mb) 64 : 64M 65 : 64M (for 128Mb/512Mb) 28 : 128M 29 : 128M (for 128Mb/512Mb) 56 : 256M 57 : 256M (for 512Mb/2Gb) 51 : 512M 52 : 512 ...

  • Samsung DDR3 - page 5

    October 2009 General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product ) 240Pin DDR3 Unbuffered DIMM Org. Density Pa rt Number Speed Raw Card Comp osition Comp. Ve r s i o n Internal Banks Rank PKG Height Ava i l . Note 128Mx 64 1GB M378B2873DZ1 CF8/H9 A(1Rx8) 128M x 8 * 8 pcs 1Gb D-die 81 78 + ...

  • Samsung DDR3 - page 6

    October 2009 General Information DDR3 SDRAM 4.3 204Pin DDR3 SoDIMM (1.5V Produc t) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Compo sition Comp. Ve r s i o n Internal Banks Rank PKG Height A vail. Note 128Mx 64 1GB M471B2874DZ1 CF8/H9 A(2Rx16) 64M x 16 * 8 pcs 1Gb D-die 8 2 96 + 4 ball FBGA 30mm Now M471B2873EH1 CF8/H9 B(1Rx8) 128M ...

  • Samsung DDR3 - page 7

    October 2009 General Information DDR3 SDRAM 4.5 240Pin DDR 3 Registere d DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Sp ee d Raw Card Composition Comp. Ve r s i o n Internal Banks Rank PKG Height Av a il . No te 128Mx 72 1GB M393B2873DZ1 CF8/H9 A(1Rx8) 128M x 8 * 9 pcs 1Gb D-die 81 78 + 4 ball FBGA 30mm Now M393B2873EH1 ...

  • Samsung DDR3 - page 8

    October 2009 General Information DDR3 SDRAM 4.6 240Pin DDR3 Registe red DIMM (1.35V Product) * Note : 1.35V product is 1.5V operatable. 240Pin DDR3 Registered DIMM Org. Density Part Number Sp ee d Raw Card Composition Comp . Ve r s i o n Internal Banks Rank PKG Height A vail. Note 128Mx 72 1GB M393B2873EH1 YF8/H9 A(1Rx8) 128M x 8 * 9 pcs 1Gb E-die ...

  • Samsung DDR3 - page 9

    October 2009 General Information DDR3 SDRAM 4.7 240Pin DDR3 VLP Register ed DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number S peed Raw Card Composition Comp. Ve r s i o n Internal Banks Rank PKG Height Av a i l . Note 128Mx 72 1GB M392B2873DZ1 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb D-die 81 78 + 4 ball FBGA 18.75mm Now M39 ...

  • Samsung DDR3 - page 10

    October 2009 General Information DDR3 SDRAM 4.8 240Pin DDR3 VLP Register ed DIMM (1.35V Product) * Note : 1.35V product is 1.5V operatable. 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Com position Comp. Ve r s i o n Internal Banks Rank PKG Height A vail. Note 128Mx 72 1GB M392B2 873EH1 YF 8/H9 K(1Rx8) 128M x 8 * 9 pcs 1G ...

  • Samsung DDR3 - page 11

    October 2009 General Information DDR3 SDRAM 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 Made in Korea M393B5170EH1-CH9 0920 5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example 5.3 RCD Information - Example Vo l t a g e V endor Revision Module P/N JEDEC Description On Label 1.5V Inphi GS04 B2 M393B517 ...

  • Samsung DDR3 - page 12

    October 2009 General Information DDR3 SDRAM 78 + 4Ball FBGA for 1Gb D-die (x4/x8 ) 96 + 4Ball FBGA for 1Gb D-die (x16) A B C D E F G H M N 9.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 10 = 8.00 4.00 0.80 4.80 82 - ∅ 0.45 Sol der ball 0.2 AB M (Datum B) (Datum A) 1 0 87654321 11 9 1.60 MOLDING AREA #A1 INDEX MARK B A 11 . 0 0 ± 0.10 J K L 0.80 0.80 (Post ...

  • Samsung DDR3 - page 13

    October 2009 General Information DDR3 SDRAM 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4 /x8) / 2Gb C-die (x4/x8) 96Ball FBGA for 1Gb E-die (x16) A B C D E F G H M N 7.50 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6.40 3.20 0.80 4.80 78 - ∅ 0.45 Sol der ball 0.2 AB M (Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B A 11 . 0 0 ± 0.10 J K L 0. ...

  • Samsung DDR3 - page 14

    October 2009 General Information DDR3 SDRAM 78Ball FBGA for 2Gb B-die (x4/x8) 96Ball FBGA for 2Gb B-die (x16) A B C D E F G H M N 9.00 ± 0.10 0.80 x 12 = 9.60 3.20 0.80 4.80 78 - ∅ 0.45 Solder ball 0.2 AB M (Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B A BOTTOM VIEW 11 . 5 0 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅ 0.50 ± 0.05) (0.95) ...

  • Samsung DDR3 - page 15

    October 2009 General Information DDR3 SDRAM 78Ball DDP for 1Gb D-die (x4) 78Ball DDP for 1Gb E-die (x4/x8) Bottom To p Bottom To p A B C D E F G H M N 0.80 x 12 = 9.60 0.80 x 8 = 6. 40 4.00 0.80 4.80 82 - ∅ 0.45 Solder ball 0.2 AB M (Datum B) (Datum A) 87654321 9 1.60 #A1 INDEX MARK B A 1 1.00 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅ 0.50 ± 0.05 ...

  • Samsung DDR3 - page 16

    October 2009 General Information DDR3 SDRAM 78Ball DDP for 2Gb B-die (x4/x8) Bottom To p A B C D E F G H M N 10.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6. 40 3.20 0.80 4.80 78 - ∅ 0.45 Solder ball 0.2 AB M (Datum B) (Datum A) 87654321 9 1.60 #A1 INDEX MARK B A 1 1.50 ± 0.10 J K L 0.80 0.80 (Post Reflow ∅ 0.50 ± 0.05) 0.10MAX 1.40 ± 0. 10 #A1 ...

  • Samsung DDR3 - page 17

    October 2009 General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM 133.35 ± 0.15 Max 4.0 54.675 Units : Millimeters 9.50 128.95 (2) (4X)3.00 ± 0.1 30.00 ± 0.15 2.30 17.30 A B 47.00 71.00 2.50 1.00 0.2 ± 0.15 2.50 ± 0.20 Deta il B 5.00 Detail A 1.50±0.10 0.80 ± 0.05 3.80 2x 2.10 ± 0.15 2.50 SPD N/A (for x72) (for x64) ECC ...

  • Samsung DDR3 - page 18

    October 2009 General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM 0.25 MAX 2.55 Deta il B Deta il A 1.00 ± 0.10 0.45 ± 0.03 4.00 ± 0.10 67.60 SPD 0.10 AB M C 2X 4.00 ± 0.10 0.10 AB M C 2X 1.80 (OPTIONAL HOLES) 0.60 Units : Millimeters 21.00 24.80 63.60 39.00 A B 1.65 6 30.00 ± 0.15 20.00 Max 3.8 1.00 ± 0.10 0.10 AB M C ...

  • Samsung DDR3 - page 19

    October 2009 General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Register Address, Command and Control lines AB 47.00 71.00 Units : Millimeters 9.50 128.95 (2X)3.00 17.30 Register 1.00 0.2 ± 0.15 2.50 ± 0.20 Deta il B 5.00 Deta il A 1.50±0.10 0.80 ± 0.05 3.80 2.50 9.76 18.92 32.40 18.93 9.74 10.9 C Deta il C 10.9 R 0 .5 0 0.4 2 ...

  • Samsung DDR3 - page 20

    October 2009 General Information DDR3 SDRAM 133.15 ± 0.2 4.65 ± 0.12 2 130.45 ± 0.15 127 ± 0.12 23.6 ± 0.15 25.6 ± 0.15 7.45 1 19.29 80.78 Green Line : TIM Att atch Line 0.4 1 +0/ -0.3 0.65 ± 0.2 R 0 . 2 R0.1 1 25.6 ± 0.15 0.15 1.3 1.3 2 2 ± 0.1 2.6 ± 0.2 1. FRONT P A RT Reg. pedestal li ne Outs ide Inside Green Line : TIM Att atch Line O ...

  • Samsung DDR3 - page 21

    October 2009 General Information DDR3 SDRAM 19 ± 0.1 39.3 ± 0.2 D 19 E (Clip open size) K text mark ’B’ or ’K’ punch press_stamp B A 39.3 ± 0.2 29.77 R 1. 5 0.1 ~ 0.3 Upper Bending Tilting Gap 0.5 3. CLIP P ART C 1.05 132.95 ± 133.45 1.27 4. DDR3 RDIMM ASS’Y View Reference thickness total (Maximum) : Mono Pac kage : 7.55mm, DDP Packag ...

Manufacturer Samsung Category Computer Hardware

Documents that we receive from a manufacturer of a Samsung DDR3 can be divided into several groups. They are, among others:
- Samsung technical drawings
- DDR3 manuals
- Samsung product data sheets
- information booklets
- or energy labels Samsung DDR3
All of them are important, but the most important information from the point of view of use of the device are in the user manual Samsung DDR3.

A group of documents referred to as user manuals is also divided into more specific types, such as: Installation manuals Samsung DDR3, service manual, brief instructions and user manuals Samsung DDR3. Depending on your needs, you should look for the document you need. In our website you can view the most popular manual of the product Samsung DDR3.

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A complete manual for the device Samsung DDR3, how should it look like?
A manual, also referred to as a user manual, or simply "instructions" is a technical document designed to assist in the use Samsung DDR3 by users. Manuals are usually written by a technical writer, but in a language understandable to all users of Samsung DDR3.

A complete Samsung manual, should contain several basic components. Some of them are less important, such as: cover / title page or copyright page. However, the remaining part should provide us with information that is important from the point of view of the user.

1. Preface and tips on how to use the manual Samsung DDR3 - At the beginning of each manual we should find clues about how to use the guidelines. It should include information about the location of the Contents of the Samsung DDR3, FAQ or common problems, i.e. places that are most often searched by users in each manual
2. Contents - index of all tips concerning the Samsung DDR3, that we can find in the current document
3. Tips how to use the basic functions of the device Samsung DDR3 - which should help us in our first steps of using Samsung DDR3
4. Troubleshooting - systematic sequence of activities that will help us diagnose and subsequently solve the most important problems with Samsung DDR3
5. FAQ - Frequently Asked Questions
6. Contact detailsInformation about where to look for contact to the manufacturer/service of Samsung DDR3 in a specific country, if it was not possible to solve the problem on our own.

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